Argotech attended Finetech Micro Assembly Day 2016

On 10 March 2016, Finetech hold the Micro Assembly Day 2016 in Berlin, Germany. The ADDAPT project partner Argotech reported about their expertise in packaging for microelectronics and highlighted the good approaches and reults which where achieved in the RF packaging for the ADDAPT project.The one-day conference is a platform for active knowledge-sharing and networking, aimed at experts and interested professionals from industry and science. It highlights current advanced packaging technologies and applications and offers insight in the latest micro assembly trends and concepts. High-profile speakers from industry and science will provide in-depth information on the current state of technology as well as their actual implementation in current market applications.

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