Work packages

The project is divided into 6 work packages, each coordinated by one of the partners as a leader:

WP1 Project management TUD
WP2 Market studies, dissemination, standardisation TE & VIS
WP3 Network analysis, system design, verification platform IBM
WP4 Optical components VIS
WP5 Integrated circuits TUD
WP6 PCB and packaging AT

WPs